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Special Issue

Call for Contributions – Special Issue

Supply Chain Forum: An International Journal

🌐 https://www.tandfonline.com/journals/tscf20

Implementing the Physical Internet: Supply Chain Intelligence, Business Innovation and Transition Pathways

Purpose

The Physical Internet (PI) is moving from vision to reality. Beyond foundational concepts, organizations are now experimenting with pilots, demonstrators, living labs and large-scale initiatives that test how PI principles can be implemented, governed and scaled. This Special Issue seeks rigorous, practice-oriented and empirically grounded contributions that provide actionable insights for managers, policymakers and supply chain stakeholders. The Special Issue is associated with the IPIC 2026 International Conference (June 2026, France), but submissions are open to all authors.

Scope and Orientation

We welcome papers focusing on the implementation and operationalization of the PI, including:

  • Empirical studies (qualitative, quantitative or mixed methods)
  • Case studies, pilots, demonstrators and living labs
  • Practice-based research and industry-driven innovations
  • Funded projects and cross-industry initiatives

Conceptual contributions are welcome only if strongly connected to real implementation challenges and managerial implications.

Topics of Interest (non-exhaustive)
  • PI use cases, pilots and demonstrators
  • Business models and value creation in open and shared logistics
  • Governance and coordination mechanisms for interoperable networks
  • Supply chain intelligence, data sharing and digital platforms
  • Transition pathways, roadmaps and maturity models
  • Managerial and organizational challenges of PI adoption
  • Public policy, regulation and public–private collaboration
  • Sustainability, circular logistics and environmental performance

All submissions are expected to adopt a sound scientific methodology while clearly demonstrating managerial relevance and actionable lessons learned.

Keywords

Physical Internet, Supply Chain Intelligence, Business Models, Use Cases, Living Labs, Demonstrators, R&I Projects, Transition Roadmaps, Governance, Collaboration, Innovation Management, etc.

Guest Editors
  • Dr. Louis FAUGERE, Amazon Research & Georgia Institute of Technology (USA)
  • Prof. Markus GERSCHBERGER, University of Applied Sciences Upper Austria & Austrian Supply Chain Intelligence Institute – ASCII (Austria)
  • Prof. Matthieu LAURAS, KEDGE Business School (France)
Deadline 
  • 15 September 2026 – Submission platform opened
  • 30 November 2026 – Paper submission deadline
Submission

Manuscripts must follow the author guidelines of Supply Chain Forum: An International Journal and be submitted via the journal’s online system: https://www.tandfonline.com/journals/tscf20

All papers will undergo a blind peer-review process.